Brainscaleintelligencewithatomicscaletechnology

With only 28nm process, we enable:

  • 330GB @ 4.2 PB/s DRAM on die that obsletes HBM and interposers
  • 14,438 tokens/s80B-parameter decode at FP8 on single die
  • 248× tokens/W25.8 mJ per token vs ~6.4 J for HBM-bound GPUs
  • Space-gradeIntrinsically rad-hard — cosmic rays leave no lattice damage
64 tiers stacking into one monolithic dieLogic + memory fused — drag to rotate
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Tell us about your GPU ambitions. We help teams turn planar roadmaps into hyperstacked AI chips with clear cost, yield, and reliability plans.