330GB @ 2.1 PB/s DRAM on die that obsoletes HBM and interposers
14,438 tokens/s80B-parameter decode at FP8 on a single die
174× tokens/W25.8 mJ per token vs ~4.5 J for HBM4 GPUs
Space-gradeIntrinsically rad-hard — cosmic rays leave no lattice damage
750 mm² die · 27.4 × 27.4 mm
64 tiers stacking into one monolithic dieLogic + memory fused — drag to rotate
Products
Four Products, One Mission
The tool that grows the atoms, the chip those atoms make possible, the package that lets a gigawatt of those chips behave as one machine — and the AI that carries a person beyond this life.